单片机型号：STM32CubeF0
本文介绍STM32CubeF0固件架构。 STM32CubeF0固件架构图如下图所示。 1、Board Support Package (BSP) This layer offers a set of APIs relative to the hardware components in the hardware boards
(such as LCD, Audio, microSD and MEMS drivers). It is composed of two parts:
• Component
This is the driver relative to the external device on the board and not to the STM32. The
component driver provide specific APIs to the BSP driver external components and could be portable on any other board.
• BSP driver
It allows linking the component
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